Ideal for medium and high-density applications, the new APC InRow OA captures up to 27kW of hot IT exhaust air at the source, neutralises it and discharges cool, ambient air to the IT space. The OA includes integrated thermal containment, which eliminates mixing of hot and cold air streams – improving cooling predictability. Modular construction, variable speed fans, and active response controls are all integrated into one high-efficiency system. The overhead design requires zero whitespaces because it can be mounted on a rack or suspended from the ceiling above the hot aisle, improving flexibility and the ability to adapt to existing data centre environments.
This refrigerant based system has been developed to eliminate the threat from water leaks in close proximity to IT equipment. The refrigerant used in this modular, pumped system is R134a, a non-toxic solution that poses no threat to IT equipment in the event of a leak, and has no Ozone depletion potential.
The RDU is a refrigerant distribution unit capable of providing 160kW of heat rejection to the APC InRow OA cooling units, and its modular construction, variable speed pumps, and active response controls are integrated into the highly efficient variable volume pumping system. The RDU has the ability to modulate capacity from 0-100 percent with no minimum loading requirements and may be placed in the IT environment or in an adjacent location to further increase whitespace utilisation for IT equipment.
Other key components to this system include modular piping headers and the mounting structure of the APC InRow OA. The piping headers are an integrated part of the mounting structure of the APC InRow OA to simplify installation and reduce initial investment costs.
Key benefits of new APC InRow OA include:
· Ability to maximize available floor space for IT equipment
· Address concerns about water in the data centre
· 30-50% more efficient than traditional raised floor data centre cooling
· Elimination of hot spots caused by high-density deployments
· Flexibility to easily deploy and redeploy cooling
· Simple to install minimising initial investment
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